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外文期刊:

1 Hao Lu, Chun Yu. Current crowding and its effects on electromigration and interfacial reaction in lead free solder joints. Journal of Electronic Packaging, accepted.(PDF)

2 Chun Yu, Hao Lu, Shiming Li. Effect of Zn addition on the formation and growth of intermetallic compound at Sn–3.5 wt% Ag/Cu interface. Journal of Alloys and Compounds, accepted.(PDF)

3 J.J. Xu, L.G.Chen, C.Z.Ni.  A study on the mechanical stress relieving and safety assessment without post-weld heat treatment. Materials Science and Engineering A. 443(2007): 107-113.

4 Chun Yu, Hao Lu. First-principles calculations of the effects of Cu and Ag additions on the electromigration of Sn-based solder. Journal of Applied Physics, 2007, 102: 054904.(PDF)

5 JiJin Xu, Ligong Chen, Chunzhen Ni. Effect of vibratory weld conditioning on the residual stresses and distortion in multipass girth-butt welded pipes. International Journal of Pressure Vessels and Piping. 84 (2007)298303.

6 Chun Yu, Junyan Liu, Hao Lu, Peilin Li, Junmei Chen. First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x = 0, 1, 2) intermetallic compounds. Intermetallics, 2007, 15: 1471-1478.(PDF)

7 Junyan Liu, Hao Lu, Junmei Chen, Zhiliang Zhang. Finite element simulation of martensitic transition based on thermomechanical model. Journal of Materials Science and Engineering A, 2007,448: 204-209.(PDF)

8 C Yu, H Lu, R Z Fan, S M Li. Factors influencing current density distribution and current crowding in flip chip solder joints. Science and Technology of Welding and Joining, 2007, 12: 423-429.(PDF)

9 Chun Yu, Junyan Liu, Hao Lu, Junmei Chen. Study of the effects of an adatom Sn on the Cu surface electromigration using a first principles method. Applied Surface Science, 2007, 253: 8652-8656.(PDF)

10 Chun Yu, Junyan Liu, Hao Lu, Peilin Li, Ruizhi Fan, Junyan xiao. First-principles investigation of pressure induced changes in structural and electronic properties of Y2C3 superconductor, Solid State Communications, 2007,142: 536-540.(PDF)

11 J.J. Xu, Z.Q.Zhu, L.G.Chen, et al.  Study of temperature distribution and residual stresses during multipass welding of thick plates with narrow gap. Materials Science and Technology. 2006, 22(2):232-236.

12 Chun Yu, Junyan Liu, Hao Lu, Junmei Chen. Ab initio calculation of the properties and pressure induced transition of Sn. Solid State Communications, 2006, 140: 538-543.(PDF)

13 C Yu, M F Wu, H Lu. Factors influencing formation and growth of coarse Ti-Fe compound in Ti-Fe eutectic reaction. Science and Technology of Welding and Joining, 2006, 11: 265-270.(PDF)

14 J.J. Xu, L.G.Chen, C.Z.Ni. Effects of Vibratory Weld Conditioning on the Residual Stresses and Transverse Contraction Distortions in Multipass Welding. Science and Technology of Welding and Joining. 2006, 11(4): 374-378.

15 H. Lu, J. Wang and H. Murakawa. Numerical study on local PWHT of butt welded pipe (Report1). Quarterly Journal of the Japan Welding Society. 2001,19(3): 416-423.(PDF)
16 Hidakazu M, Wang J, Lu H. Suitable heating conditions in local heat treatment, WRC Bulletin 485, 2003, Sept. (PDF)
 

中文期刊:

1 刘俊䶮,陆皓,陈俊梅, 基于相变诱导塑性的Satoh实验的有限元模拟, 焊接学报,2008年第3期.

2 余春,陆皓,陈俊梅。电流载荷对Sn-3.5wt% Ag/Cu界面Kirkendall空洞的影响. 中国有色金属学报, 录用.

3 余春,李培麟,刘俊龑,陆皓,陈俊梅.典型Sn基焊料凸点互连结构电迁移异同性. 半导体学报, 2007,28(4): 619-624.(PDF)

4 樊睿智,刘俊龑,陆皓,张茂龙,钱旭辉,胡永强.异种钢管子对接焊热处理前后残余应力的数值模拟.焊接,2007,5:54-56.(PDF)

5 陆皓,陈俊梅,刘俊龑,陈家本,郑慧锦.薄板焊接失稳变形的简化模型及其应用,焊接,2007,5:16-18.(PDF)

6 余春,陆皓,聂树文,赵双宝.Sn-3.5Ag-1.0Zn/Cu界面微观组织演变及接头力学性能,焊接,20078156-158.(PDF)

7 陆皓, 汪建华.Cr-Mo钢管子局部焊后热处理加热宽度影响因素. 焊接学报, 2006,27(3):5-8.(PDF)

8 徐济进,陈立功,张敏等. A105钢双丝埋弧焊厚板对接试验及测量系统. 焊接学报. 2006, 27(8):95-98

9 徐济进,陈立功,倪纯珍. 厚板角接多道焊温度、变形及残余应力的研究. 焊接学报. 2006, 27(5):97-100

10  陈俊梅,陆皓,周永华,魏良武,陈玉. 挖掘机下车架主件顶环面的平面度. 焊接学报.2004, 25(1): 107-110

 

会议:

1 余春,陆皓.第十二次全国焊接会议(第十五届全国钎焊及特种连接技术交流会),合肥,200710183-186

2 Liu junyan , Lu hao, Chen junmei, Welding deformation prediction of complex structure under optimization of welding procedure, Proceeding of International Symposium on Computer-Aided Welding Engineernig 2006

3 余春,陆皓,陈俊梅.Sn元素对Cu表面电迁移影响机制的第一性原理研究. 2006上海电子互连技术及材料国际论坛,1-

4 余春,陆皓,陈俊梅.CuAl互连引线(100)面点迁移抑制机理的第一性原理研究.2006材料科学与工程全国博士生学术论坛,517-519.

5 Jijin XU, Ligong CHEN, Chunzhen NI.  Effects of Vibratory Weld Conditioning and Wind Cooling Method on the Residual Stresses and Transverse Contraction Distortion in Multipass Welding.  International Conference on Mechanical Engineering and Mechanics. 20051228-1231

6 Xu Jijin, Chen Ligong,Ni Chunzhen. Effect of Vibratory Welding Condition on the Residual stresses and Distortion in Submerged Arc Multipass Welding. International Conference on Welding Science and Engineering. 200548-53


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